Description:

NANOSCALE INTERCONNECTS FABRICATED BY ELECTRICAL FIELD DIRECTED ASSEMBLY OF NANOELEMENTS

INV-1010

INVENTORS:  Ahmed Busnaina, Cihan Yilmaz, Taehoon Kim, Sivasubramanian Somu

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Description

Many prior art approaches have been used to integrate nanoelements for fabrication of nanostructures.  On the other hand, fewer approaches are available for assembly of such nanoelements for sensors and CMOS interconnect applications.  Dielectrophoresis, high/low pressure vapor deposition and electroplating are some of the common approaches used in this regards.  However, most of these techniques are associated with possible limitations such as decreased efficacy in higher aspect ratio range, increased resistivity and electro-migration; resulting in reduced performance of such assemblies.  This novel procedure enables efficient development and use of nano interconnects fabricated at a large scale using electrical field based assembly of nanoelements.

 

Value Proposition

The procedure:

•Is extremely cheap and cost effective, allowing effective performance at room temperature and pressure, as compared to some of prior art procedures requiring high or low temperatures/pressures

•Enables an effective reduction of grain boundaries, one of process limitations as observed with prior art procedures, thereby keeping a constant check at overall resistivity and electromigration

•Is effective in assembling both charged and uncharged particles

•Is further utilized with high aspect ratio as compared to conventional procedures

•Allows for production of nanoscale interconnects that are useful for variety of commercial applications such as in electronics, photonics, and biomedical devices

 

Intellectual Property status

Pending Utility Application 13/499,809

Pending European National Application 10821336.4

License status 

Available for license

Patent Information:
For Information, Contact:
Mark Saulich
Associate Director of Commercialization
Northeastern University
m.saulich@northeastern.edu
Inventors:
Ahmed Busnaina
Taehoon Kim
Sivasubramanian Somu
Cihan Yilmaz
Keywords:
Circuits
Electronics
Fabrication
Manufacturing
Materials
Nanotechnology