Description:

INTERFACIAL CONVECTIVE ASSEMBLY FOR HIGH ASPECT RATIO STRUCTURES WITHOUT SURFACE TREATMENT

INV-1019

INVENTORS: Nam-Goo Cha, Yolanda Ehegoyen, Ahmed Busnaina, Taehoon Kim

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Description

Many nanoparticle assembly approaches such as convective assemblies, metal deposition methods (such as evaporation), and dip coatings have been used till date.  However, these approaches are associated with possible limitations such as a poor selectivity, an increased temperature, and need of special vacuum systems in case of metal deposition; a long process time, and an application difficulty (especially for thin and bendable substrates) in case of dip coating; and a surface treatment requirement for convective assembly.  This novel method involves an interfacial convective assembly of nanoparticles into high aspect nanostructures without using common prior art assembling requirements such as surface treatment, particle charge, electric current, and excess heat.

 

Value Proposition

The method:

•Is fast, effective, scalable and economical as compared to prior art techniques

•Is effective for assembly of nanoparticles on both hydrophobic and hydrophilic surfaces

•Enables assembly of nanoparticles even on flexible and bendable substrates

•Enables the prevention of evaporation and increased temperature as opposed to prior art procedures

•Involves automatic convective flows due to liquid density differences, thereby avoiding use of other conventional requirements

•Is effectively used for assembling electronic and electrochemical systems such as nanowires, antennas, sensors, photonic devices, information storage medium, and display/optical and medical (e.g., drug release) devices on a commercial scale

 

Intellectual Property status

Pending Utility Application 13/702,133

License status 

Available for license

Patent Information:
For Information, Contact:
Mark Saulich
Associate Director of Commercialization
Northeastern University
m.saulich@northeastern.edu
Inventors:
Ahmed Busnaina
Nam-Goo Cha
Yolanda Ehegoyen
Taehoon Kim
Keywords:
Fabrication
Materials
Nanotechnology