Passive Thermal Management of rf Components Using Graphene-Based Phase Change Materials

Description:

Background

Due to rapid advancement in electronic systems, there is a high demand in both the military and commercial sectors for components, systems, and platforms that achieve size, weight, power, and cost reductions miniaturization and performance enhancement (SWaP+C) in the rf (radio frequency) domain. These characteristics lead to increased heat generation and failure to dissipate the heat away from the key components can lead to failure of the system and reduce the efficiency. Existing thermal dissipation methods including forced convection cooling are not suitable for novel systems. 

This invention discloses a passive thermal management solution to address heat dissipation as intermittent systems operating in the rf domain. 

Technology Overview

Researchers at Northeastern University have invented a passive heat dissipation system consisting of phase-change material (PCM) for rf applications. The PCM system consists of a non-conductor (paraffin) and a conductor (graphene). When the heat increases above 60 °C the heat is removed from the component during the melting phase. As the molten PCM resolidifies, the heat is released to the surrounding environment (air gap enclosing the packaging). The PMC-graphene system provides a higher thermal conductivity than conventional PMCs in a lightweight system. 

Benefits

• Compatible with SWaP paradigm 
• Passive system. External source or moving parts are not involved 
• Lightweight and less bulky 
• Higher thermal conductivity 
• Wider range of applications 
• Cost-effective 

Applications

 Ideal thermal management solution for 

• Magnetic devices and RF components, including self-biased circulators, isolators, power cores for power electronics 
• Modern radar, communications, sensing, tracking, guided munitions, and other high-frequency systems